Hate to break it to you, but the 3.5" form factor would absolutely not be cheaper than an equivalent bunch of E1.S or M.2 drives. The price is not inflated due to the form factor, it’s driven primarily by the cost of the NAND chips, and you’d just need more of them to take advantage of bigger area. To take advantage of the thickness of the form factor, it would need to be a multi-board solution. Also, there’d be a thermal problem, since thermal characteristics of a 3.5" application are not designed with the thermal load of that much SSD.
Add to that that 3.5" are currently maybe 24gb SAS connectors at best, which means that such a hypothetical product would be severely crippled by the interconnect. Throughput wise, talking about over 30 fold slower in theory than an equivalent volume of E1.S drives. Which is bad enough, but SAS has a single relatively shallow queue while an NVME target has thousands of deep queues befitting NAND randam access behavior. So a product has to redesign to vaguely handle that sort of product, and if you do that, you might as well do EDSFF. No one would buy something more expensive than the equivalent capacity in E1.S drives that performs only as well as the SAS connector allows,
The EDSFF defined 4 general form factors, the E1.S which is roughly M.2 sized, and then E1.L, which is over a foot long and would be the absolute most data per cubic volume. And E3.S and E3.L, which wants to be more 2.5"-like. As far as I’ve seen, the market only really wants E1.S despite the bigger form factors, so I tihnk the market has shown that 3.5" wouldn’t have takers.
Hate to break it to you, but the 3.5" form factor would absolutely not be cheaper than an equivalent bunch of E1.S or M.2 drives. The price is not inflated due to the form factor, it’s driven primarily by the cost of the NAND chips, and you’d just need more of them to take advantage of bigger area. To take advantage of the thickness of the form factor, it would need to be a multi-board solution. Also, there’d be a thermal problem, since thermal characteristics of a 3.5" application are not designed with the thermal load of that much SSD.
Add to that that 3.5" are currently maybe 24gb SAS connectors at best, which means that such a hypothetical product would be severely crippled by the interconnect. Throughput wise, talking about over 30 fold slower in theory than an equivalent volume of E1.S drives. Which is bad enough, but SAS has a single relatively shallow queue while an NVME target has thousands of deep queues befitting NAND randam access behavior. So a product has to redesign to vaguely handle that sort of product, and if you do that, you might as well do EDSFF. No one would buy something more expensive than the equivalent capacity in E1.S drives that performs only as well as the SAS connector allows,
The EDSFF defined 4 general form factors, the E1.S which is roughly M.2 sized, and then E1.L, which is over a foot long and would be the absolute most data per cubic volume. And E3.S and E3.L, which wants to be more 2.5"-like. As far as I’ve seen, the market only really wants E1.S despite the bigger form factors, so I tihnk the market has shown that 3.5" wouldn’t have takers.